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Intel expects to see Moore’s law continue for the near future and also plans for its x86 processor architecture to extend across everything from small embedded devices right up to supercomputers, according to the head of its Digital Enterprise group, Pat Gelsinger. However, programming techniques are going to have to evolve to make better use of many-core chips.
Speaking at a briefing to mark Intel’s 40th anniversary, Gelsinger gave his predictions for the future of computer technology, focusing on the key areas of Moore’s law, many-core chips, the Intel architecture (IA), and visual computing. Gelsinger said that Moore’s law would continue to extend into the future, and said that Intel has a roadmap for 32nm, 22nm and 10nm chips.
“I can recall in the past we thought reaching 1 micron (1 micrometre) would be hard,” he commented, adding that as each milestone was reached, the way ahead became clearer, despite predictions that Moore’s law was running out of steam.
View: The full story @ vnunet

Intel expects to see Moore’s law continue for the near future and also plans for its x86 processor architecture to extend across everything from small embedded devices right up to supercomputers, according to the head of its Digital Enterprise group, Pat Gelsinger. However, programming techniques are going to have to evolve to make better use of many-core chips.

Speaking at a briefing to mark Intel’s 40th anniversary, Gelsinger gave his predictions for the future of computer technology, focusing on the key areas of Moore’s law, many-core chips, the Intel architecture (IA), and visual computing. Gelsinger said that Moore’s law would continue to extend into the future, and said that Intel has a roadmap for 32nm, 22nm and 10nm chips.

“I can recall in the past we thought reaching 1 micron (1 micrometre) would be hard,” he commented, adding that as each milestone was reached, the way ahead became clearer, despite predictions that Moore’s law was running out of steam.

View: The full story @ vnunet

Preempting Intel’s official launch of its latest Centrino 2 mobile processors, PC makers and chip resellers are leaking processor details by letting customers preorder the chip through channels and in laptops. The Centrino 2 platform, codenamed Montevina, is an upgrade to Intel’s current Centrino platform and will include five Core 2 processors running at clock speeds between 2.26GHz and 3.06GHz. The chip will also come with WiMax support.
Due by the end of June, the launch of the chip was later delayed to July due to chipset problems. It is now due July 14. The processors are being offered by Santech , a European PC vendor, in its X46 laptop. The laptop will support up to 4G bytes of RAM, include a 15.4-inch display, WiMax capabilities and wireless A/G/N networking. The X46 prices begin at €619 (US$963).
View: The full story @ InfoWorld

The head of BFG Technologies, a well-known Nvidia-exclusive supplier of graphics cards, admitted in an interview that Intel Corp.’s highly anticipated code-named Larrabee graphics processing unit (GPU) would change the market of graphics processors, however, he still said that Nvidia would be able to remain on top.
“Next year we’re going to see a completely different competitive landscape and it will change how people buy graphics cards,” said Scott Herkelman, the president of BFG Technologies, said in an interview with Hexus web-site.

View: The full story @ Xbit Labs

Intel plans to launch three Nehalem-based quad-core processors (Bloomfield) at the end of the fourth quarter this year targeting the company’s new LGA1366 socket, according to sources at motherboard makers.
Although official model names have not yet been set, the CPUs are currently identified by the codenames XE, P1 and MS3 with core frequencies of 3.2GHz, 2.93GHz and 2.66GHz, respectively. All three have a TDP of 130W, 8MB L3 cache and will support simultaneous multi-threading (SMT) technology, the sources detailed
View: The full story @ DigiTimes

Advanced Micro Devices, Nvidia Corp. and Via Technologies have not yet started development of their own next-generation universal serial bus (USB) controller as they cannot get specifications of the bus from Intel Corp. The latter denies any wrongdoing or intention to affect competitive positions of AMD, Nvidia and others as well as claims that the spec is not finalized. “The challenge is that Intel is not… giving the specification to anybody that competes with CPUs and chipsets,” a source close to AMD who is familiar with the dispute between chipset developers and Intel is reported to have said by News.com web-site.
While retaining full backward compatibility with USB 1.0 and USB 2.0, devices that feature USB 3.0 will be able to transfer data at up to 10 times higher speed compared to USB 2.0, or at 4.8Gb/s, meaning that a file as large as 600MB could be transferred in just a second in the best case scenario. In addition, the USB 3.0 specification will be optimized for low power and improved protocol efficiency. USB 3.0 ports and cabling will be designed to enable backward compatibility as well as future-proofing for optical capabilities.
View: The full story @ Xbit Labs

nVidia and AMD are looking to wrest control from Intel over the specification for USB 3.0.
USB 3.0 is the next-generation high-speed connection standard due out next year that is expected to offer 10 times the speed of USB 2.0.
At issue is that Intel is allegedly not giving the specification to competitors in the CPU or chipset markets. Intel responds that it is “working hard to get the complete spec” to the industry. One source close to Intel alleges that nVidia and Intel are seeking the “host controller “specification that Intel says is beyond the USB 3.0 specification.
View: CNET: nVidia, AMD vie with Intel over USB 3.0

Intel gives users the tools to squeeze extra performance from their systems by overclocking the processor, but don’t expect the warranty to cover you if things go wrong. Overclocking capabilities are a main feature of Intel’s 4 series chipset, said Eric Mentzer, Intel’s vice president and general manager of the Graphics Development Group, in an interview at the Computex exhibition in Taipei
“We spend a lot of time working with our motherboard partners to figure out all the hidden bits inside, helping them figure out how to bring the best out of these platforms,” Mentzer said.That same ability is available to users, but it hasn’t always been. Intel used to lock down its chips to prevent overclocking, but the company’s mindset has changed. Overclockers are now viewed as an important market segment, rather than troublemakers.
View: The full story @ PCWorld

Three of Intel’s chipsets, the G31, G33 and 945GC, are seeing an increase in price following the earthquake in Sichuan, China last week, according to sources at motherboard makers. Although Intel’s packaging and testing plant in Sichuan was unaffected by the quake, the local transport infrastructure has been severely impacted. The three chipsets occupy approximately 45% of Intel’s desktop chipset shipments which has lead to rapid shortages.
The 945GC is seeing an increase from around US$15 in thousand-unit tray quantities to US$18-19, while the G31 will see its price boost from US$23 to US$25-27 and the G33 from US$28 to US$31.
View: The full story @ DigiTimes

While basic features of Intel’s next-generation desktop platform based on code-named Bloomfield processors are commonly known, more precise, but still rather general, specifications were kept under wraps. Apparently, the chipset that will enable Intel’s forth-coming high-end platform is called Intel X58 and will support one physical central processing unit (CPUs) as well as up to four graphics processing units (GPUs).
According to slides, which resemble those that come from Intel Corp., published by Expreview web-site, Intel’s next-gen high-end desktop Intel X58 chipset will consist of X58 PCI Express bridge as well as ICH10 input/output controller hub. The X58 is projected to feature four PCI Express 2.0 memory controllers to support two graphics cards with two PCIe 2.0 x16 slots or four graphics cards with four PCIe 2.0 x8 slots.
View: The full story @ Xbit Labs