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The head of BFG Technologies, a well-known Nvidia-exclusive supplier of graphics cards, admitted in an interview that Intel Corp.’s highly anticipated code-named Larrabee graphics processing unit (GPU) would change the market of graphics processors, however, he still said that Nvidia would be able to remain on top.
“Next year we’re going to see a completely different competitive landscape and it will change how people buy graphics cards,” said Scott Herkelman, the president of BFG Technologies, said in an interview with Hexus web-site.

View: The full story @ Xbit Labs

Intel plans to launch three Nehalem-based quad-core processors (Bloomfield) at the end of the fourth quarter this year targeting the company’s new LGA1366 socket, according to sources at motherboard makers.
Although official model names have not yet been set, the CPUs are currently identified by the codenames XE, P1 and MS3 with core frequencies of 3.2GHz, 2.93GHz and 2.66GHz, respectively. All three have a TDP of 130W, 8MB L3 cache and will support simultaneous multi-threading (SMT) technology, the sources detailed
View: The full story @ DigiTimes

Advanced Micro Devices, Nvidia Corp. and Via Technologies have not yet started development of their own next-generation universal serial bus (USB) controller as they cannot get specifications of the bus from Intel Corp. The latter denies any wrongdoing or intention to affect competitive positions of AMD, Nvidia and others as well as claims that the spec is not finalized. “The challenge is that Intel is not… giving the specification to anybody that competes with CPUs and chipsets,” a source close to AMD who is familiar with the dispute between chipset developers and Intel is reported to have said by News.com web-site.
While retaining full backward compatibility with USB 1.0 and USB 2.0, devices that feature USB 3.0 will be able to transfer data at up to 10 times higher speed compared to USB 2.0, or at 4.8Gb/s, meaning that a file as large as 600MB could be transferred in just a second in the best case scenario. In addition, the USB 3.0 specification will be optimized for low power and improved protocol efficiency. USB 3.0 ports and cabling will be designed to enable backward compatibility as well as future-proofing for optical capabilities.
View: The full story @ Xbit Labs

nVidia and AMD are looking to wrest control from Intel over the specification for USB 3.0.
USB 3.0 is the next-generation high-speed connection standard due out next year that is expected to offer 10 times the speed of USB 2.0.
At issue is that Intel is allegedly not giving the specification to competitors in the CPU or chipset markets. Intel responds that it is “working hard to get the complete spec” to the industry. One source close to Intel alleges that nVidia and Intel are seeking the “host controller “specification that Intel says is beyond the USB 3.0 specification.
View: CNET: nVidia, AMD vie with Intel over USB 3.0

Intel gives users the tools to squeeze extra performance from their systems by overclocking the processor, but don’t expect the warranty to cover you if things go wrong. Overclocking capabilities are a main feature of Intel’s 4 series chipset, said Eric Mentzer, Intel’s vice president and general manager of the Graphics Development Group, in an interview at the Computex exhibition in Taipei
“We spend a lot of time working with our motherboard partners to figure out all the hidden bits inside, helping them figure out how to bring the best out of these platforms,” Mentzer said.That same ability is available to users, but it hasn’t always been. Intel used to lock down its chips to prevent overclocking, but the company’s mindset has changed. Overclockers are now viewed as an important market segment, rather than troublemakers.
View: The full story @ PCWorld

Three of Intel’s chipsets, the G31, G33 and 945GC, are seeing an increase in price following the earthquake in Sichuan, China last week, according to sources at motherboard makers. Although Intel’s packaging and testing plant in Sichuan was unaffected by the quake, the local transport infrastructure has been severely impacted. The three chipsets occupy approximately 45% of Intel’s desktop chipset shipments which has lead to rapid shortages.
The 945GC is seeing an increase from around US$15 in thousand-unit tray quantities to US$18-19, while the G31 will see its price boost from US$23 to US$25-27 and the G33 from US$28 to US$31.
View: The full story @ DigiTimes

While basic features of Intel’s next-generation desktop platform based on code-named Bloomfield processors are commonly known, more precise, but still rather general, specifications were kept under wraps. Apparently, the chipset that will enable Intel’s forth-coming high-end platform is called Intel X58 and will support one physical central processing unit (CPUs) as well as up to four graphics processing units (GPUs).
According to slides, which resemble those that come from Intel Corp., published by Expreview web-site, Intel’s next-gen high-end desktop Intel X58 chipset will consist of X58 PCI Express bridge as well as ICH10 input/output controller hub. The X58 is projected to feature four PCI Express 2.0 memory controllers to support two graphics cards with two PCIe 2.0 x16 slots or four graphics cards with four PCIe 2.0 x8 slots.
View: The full story @ Xbit Labs

Asustek plans to launch a new version of the Eee PC armed with Intel’s Atom microprocessor at the Computex trade show in Taipei this June, Asustek’s CEO said Monday. Atom is the name of the processor formerly called Diamondville. It was designed for low-cost laptop PCs, ultramobile PCs, Mobile Internet Devices (MIDs), and other small devices aimed at connecting to the Internet. The processor is tiny, less than 25 square millimeters, will be priced low, and run at a battery-efficient 0.6 watts to 2.5 watts thermal design power, according to Intel.
Intel developed the chip for a class of low cost laptop PCs aimed at the developing world that started with the XO laptop from the One Laptop Per Child Foundation (OLPC). The foundation’s dream of a $100 laptop for kids in poor nations has turned into a global obsession, and technology companies are climbing aboard
View: The full story @ InfoWorld

The ASUS´ Intel G35 chipset motherboards allow users to enjoy enhanced Microsoft Vista DirectX 10 graphics on a motherboard solution “right out of the box”. This series of motherboards are the world´s first to provide an Intel platform with an onboard integrated VGA solution that features built-in support for Windows Vista DirectX 10. [ASUS]

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Intel is delaying the launch schedule of its P45 chipset from originally in May to mid-June, according to sources at motherboard makers.
The delay of the chipset is due to problems over compatibility between the chipset’s PCI Express x16 port and graphics cards, noted the sources, adding that Intel has notified them that the problem should be solved and ready to launch 2-4 weeks behind the original launch schedule.
View: The full story @ DigiTimes